专业的芯片/晶圆切割胶带、UV固化胶、导电胶供应商
全国统一服务热线
0769-23329113
东莞市宝丽新材料有限公司是一家专注于半导体封装材料研发与生产的高新技术企业。公司主营芯片切割胶带、晶圆TAIKO工艺专用去边切割防静电胶带等产品，广泛应用于集成电路精密制造领域。凭借先进的生产技术和严格的质量管控，我们为客户提供高粘着精度、低残胶且具备优异防静电保护功能的胶带解决方案，有效保障晶圆切割过程的安全与效率。宝丽新材料始终以创新为动力，致力于为全球半导体行业提供稳定、可靠的高性能材料支持。
Dongguan Baoli New Material Co., Ltd. is a high-tech enterprise specializing in the R&D and production of semiconductor packaging materials. We primarily supply dicing tapes and specialized anti-static tapes for TAIKO process wafer backside grinding and dicing, which are widely used in precision integrated circuit manufacturing. Leveraging advanced production technology and strict quality control, we provide customers with high-adhesion precision, low-residue tape solutions offering excellent anti-static protection to ensure the safety and efficiency of the wafer dicing process. Baoli New Material is consistently driven by innovation, dedicated to supplying stable and reliable high-performance materials for the global semiconductor industry.
